While the Samsung Galaxy S7 got its first teardown last month, now it's time for the curvy S7 edge to receive the exact same treatment. The folks over at Chipworks have done the deed this time around, disassembling the handset and letting it reveal all of its secrets. The 12 MP camera module measures 12.1 x 12.1 x 5.4 mm. The Sony IMX260 sensor has been rumored to be inside, and while the exact model isn't written anywhere there is a Sony logo on the module's flex cable, so that tidbit could be true indeed. Near the camera module there's a STMicroelectronics K2G2IS gyroscope, used for optical image stabilization. The camera, as you may know, has 1.4 micron pixels, as well as a Dual Pixel autofocus system that's unique for the mobile world. Qualcomm's Snapdragon 820 (model MSM8996) chipset is present in this T-Mobile version of the S7 edge, along with 4GB of LPDDR4 SDRAM made by Hynix (though surely Samsung-made memory is present in other batches of the device). There's a big increase in interconnecting solder bumps between the top and bottom parts of the PoP (that's the package-on-package format in which the SoC is hidden under the RAM). This could either account for higher memory bandwidth or the need to dissipate more heat from the CPU and/or GPU. The touchscreen controller is made by Samsung itself, with part number S6SA552X. This hasn't been a widely used module so far, but that will probably change in the future. The Galaxy S7 edge also features a Knowles 9291S microphone, a Murata KM5D18098 Wi-Fi module, an NXP 67TO5 NFC controller, an IDT P9221 wireless power receiver, and an STM LPS25HB barometer. Make sure you hit the Source link below for the full...
Source: http://www.gsmarena.com/samsung_galaxy_s7_edge_teardown_exposes_all_of_its_internals-news-17055.php
