LeEco Le Pro 3 hands-on

LeEco was one of the first devices to feature a Snapdragon 821 CPU, an incremental update over Qualcomm's Snapdragon 820 chipset. It was on its way to being the first, but Asus' Zenphone 3 Deluxe beat the Ecophone to the punch10:45 . Anyway, the Le Pro 3 is the company's flagship device and it's one of two devices that the Chinese manufacturer is bringing over to the US market alongside the Le S3, a mid-range version of the Le Pro 3. The company has been working really hard to get its TVs, smartphones, and eventually a ‘Super Bike', (yeah, like a bicycle) and the ambitious company even has...



Source: http://www.gsmarena.com/just_in_leeco_le_pro_3_handson-news-22222.php

Popular Posts

Related Posts Plugin for WordPress, Blogger...