Just a couple of days after there were reports that the Huawei P8 will be announced at a special event in April, the device's specs, price, and launch date have been revealed on Weibo. As per the leaked information, the Ascend P7 successor will be powered by Huawei's latest Kirin 930 chipset, which is the first to be made using 16nm process technology. It will sport a 5.2″ Full HD screen as well as dual cameras from the Honor 6 Plus (the device might even get an upgrade to dual-13MP main cameras), and will pack a 2600mAH battery. Further, the leak also suggests that the P8 will come with double sided gorilla glass 3 protection and a ceramic uni-body design. At 6mm, it is said to be thinner than the iPhone 6, which is 6.9mm thick. The device will be priced at RMB2,999($480), and will be unveiled on April 15 in London. It was earlier rumored to be released at this year's Mobile World Congress (MWC) scheduled for early next...
Source: http://www.gsmarena.com/huawei_p8_specs_price_and_launch_date_leaked-news-11016.php
