LeEco sends out invitations for Cool1 launch event

LeEco and Coolpad (LeEco's largest shareholder) have been working closely on a flagship smartphone. The first teasers have been appearing over the last couple of weeks and have yet to confirm any specs. What the teaser did confirm though is that we can expect some kind of dual-camera system to be featured on the smartphone. The event will take place on August 16 in China and will announce the "LeEco Cool1", a high end smartphone whose rumored specs include a Qualcomm Snapdragon 820, 5.5 inch QHD screen, 4GB of RAM, 64GB of internal storage, a fingerprint sensor, Android 6.0...



Source: http://www.gsmarena.com/leeco_sends_out_invitations_for_press_event-news-19859.php

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