On Tuesday, Qualcomm kicked off its annual Summit. On the first day, the chip maker teased two new upcoming chipsets on Qualcomm's new Modular Platform. The Snapdragon 865 is the successor to the 855. Meanwhile, the Snapdragon 765/765G is a new chipset with integrated support for 5G. The Modular Platform part of the announcement offers carriers the tools to let them more easily implement their own 5G technologies to the new chipsets. Source: Qualcomm The Snapdragon 865 can be paired with the Snapdragon X55 Modem, which succeeds the X50 Modem with a newer, more power efficient...
Source: https://www.gsmarena.com/qualcomm_teases_new_snapdragon_865_and_765_announces_3d_sonic_max_fingerprint_scanner-news-40395.php
