In a post published to Weibo, Xiaomi explains how it solved a couple of issues related to heat dissipation when it comes to other foldable devices. Xiaomi explains that one of the issues with foldable devices is that the capacity of which the device can dissipate heat is dependent on whether its folding or not. The other (related) issue is that the imbalance lies herein that the side of the device that contains the SoC is will always gather more heat. With the Mi Mix Fold, Xiaomi has developed a “Butterfly” heat dissipation mechanism that can dissipate heat from one side of the...
Source: https://www.gsmarena.com/xiaomi_explains_how_mi_mix_fold_has_improved_heat_dissipation-news-48679.php
