Xiaomi Mix Fold 3 teardown reveals the new hinge and vertical stack motherboard design

Xiaomi’s Mix Fold 3 is the latest new foldable to launch in China and we now have a teardown video from WekiHome showing out the challenging work accomplished by the Xiaomi engineers. The whole process starts like any other teardown by removing the SIM card tray and prying off the back plate which reveals one half of the device. The cover screen is also carefully removed exposing both sides of the back. Removing a few covers, screws and flex cables reveals the vertical stack motherboard and quad Leica camera system. We then focus our attention to the dual battery cells with...



Source: https://www.gsmarena.com/xiaomi_mix_fold_3_teardown_reveals_the_new_hinge_and_vertical_stack_motherboard_design_-news-59566.php

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