Qualcomm announced its flagship chipset in the beginning of December at the Snapdragon Technology Summit. According to the latest leak from Weibo, the chipset company from San Diego is preparing three more SoC platforms for 2018 - Snapdragon 670, Snapdragon 640 and Snapdragon 460. The SD670 comes as a successor of the SD660. The biggest change is the process it is built on - it will be 10nm so it will be more power-efficient. The CPU will have eight cores - 4x Kryo 360 at 2 GHz and 4x Kryo 385, clocked at 1.6 GHz. The GPU will be Adreno 620 and dual 14-bit Spectra 260 ISP. It will...
Source: https://www.gsmarena.com/snapdragon_670_640_and_460_specs_leak-news-28895.php
