Samsung unveiled its latest "Multi-Chip Package" - uMCP - which combine 12GB of LPDDR4X RAM with fast UFS 3.0 storage. These are based on the latest 24-gigabit RAM chips manufactured on a 1y process (1y is the second enhancement of Samsung's 10nm-class process). In March this year Samsung produced the first 12GB RAM modules, but those used smaller capacity 16-gigabit chips (six of them). This new package contains only four 24-gigabit chips instead. Samsung is targeting the mid-range market with these and offers an alternative package with 10GB of RAM (combining two 24-gigabit and...
Source: https://www.gsmarena.com/samsung_unveils_12gb_ram_plus_ufs_30_storage_combo_packages_for_midrangers-news-39791.php
