MediaTek hosted a quick press conference in Beijing where it introduced to media representatives the Dimensity 800 chipset, aimed to power mid-range smartphones in 2020. It has an integrated 5G modem and will be a more affordable solution than the Dimensity 1000/L that can be found in the Oppo Reno3 smartphone. The company did not disclose any specs but revealed the platform will be demoed at CES 2020 in Las Vegas in the first days of the new year. Expectations are the Dimensity 800 to compete with smartphones powered by Kirin 800 series and Qualcomm Snapdragon 7 series chipsets....
Source: https://www.gsmarena.com/mediatek_introduces_the_midrange_chipset_dimensity_800_that_comes_with_integrated_5g-news-40739.php
