The Redmi K50 Gaming will be announced in China next week, and today the company shared some details about the phone’s performance. To make sure the phone is ready for heavy loads of gaming it will have a 40% better heat dissipation. The 4,860 sq.mm vapor chamber improvement is just the first out of five steps. Additionally, Xiaomi redesigned the phone's internals and introduced new materials and processes to improve efficiency. As Redmi said, “it’s not only about raw performance of the Snapdragon 8 series”, so it will introduce optimizations to the chipset that will allow games...
Source: https://www.gsmarena.com/redmi_k50_gaming_to_come_with_improved_cooling_and_shoulder_keys-news-53096.php
